congatec presents new COM Express modules with Gen 7 Intel Core processors (codename Kaby Lake)
congatec’s new modules are simply better
congatec’s new modules are simply better
Superior altitude tracking for consumer devices
MAX2175 RF to Bits® tuner-based solution reduces cables and simplifies vehicle head unit design
TI expands its module portfolio with new Bluetooth® low energy certified module with integrated antenna
Microchip announces the industry’s first FCC-certified, fully integrated RF transceiver and kits for developing IoT…
Microchip announces the industry’s first automotive-grade Local Interconnect Network (LIN) System in Package (SiP) solution…
Complete development platform with ARM® mbed™ support eliminates up to six months of design time
New Kit Simplifies Development of Cloud-Connected Devices with Multiple Sensing and Connectivity Options and with No RF Expertise Required
In order to better serve the broadening range of mar-kets it has developed products for,…
Microchip announces two new low-cost rapid prototyping boards for 32-bit applications. The PIC32MX and PIC32MZ…