Vishay Intertechnology Introduces Three New Automotive Grade IHLP® Inductors in Its Smallest 1212 Case Size
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0 mm
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0 mm
With 55 Partner Companies at Launch, the Robust Ecosystem Enables Quick and Easy Solution Selection
Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people…
CUI Devices’ Interconnect Group (https://www.cuidevices.com/catalog/interconnect) today announced the addition of screwless terminal block connectors (https://www.cuidevices.com/catalog/interconnect/connectors/terminal-blocks)…
Infineon Technologies AG will add a new member to its automotive microcontroller family AURIX™. TC3A will…
With the MX1-10FEP, ICP Deutschland launches the first embedded PC of the new modular M…
The three additions to the u-blox BMD series enable a host of new applications, from high precision indoor positioning to medical and industrial applications in challenging signal environments.
Public and private cloud infrastructure suppliers are turning to open-source tools to simplify the configuration,…
Sensirion, the expert in environmental sensing, is proud to announce that bluSensor® is using Sensirion’s environ-mental sensors in its innovative air quality device, bluSensor® AIQ.
congatec intensifies Eastern European sales and marketing activities