Sony to preview new category of machine vision module at Vision 2018
Sony Europe’s Image Sensing Solutions division is set to demonstrate the first in a new category of machine vision cameras at Vision 2018.
Sony Europe’s Image Sensing Solutions division is set to demonstrate the first in a new category of machine vision cameras at Vision 2018.
Power-management ICs offer high performance, small size, efficiency, and protection needed by advanced auto subsystems
Rugged cable assemblies ideal for rail, transportation and heavy industrial applications
Silicon Labs, a leading provider of silicon, software and solutions for a smarter, more connected…
Highest quality standards and industry-leading semiconductor components through innovation and manufacturing: In 2008, Infineon Technologies…
The compact Pico-ITX CPU Board HYPER-BW-E8 from ICP Deutschland offers a perfect overlap of graphics…
With the Mars MA3, Enclustra presents the most powerful SoC module based on the Xilinx Zynq UltraScale+ MPSoC in the Mars form factor. It features up to 6 ARM cores, a Mali 400MP2 GPU, up to 4 GByte of extremely fast DDR4 SDRAM, numerous standard interfaces, 108 user I/Os and up to 154,000 LUT4 equivalents
The SiC46X from Vishay is a family of wide input voltage high efficiency synchronous buck…
As first manufacturer ELECTRONIC ASSEMBLY has developed a complete range of OLED displays with pins for easy plug-in mounting. The high-contrast OLED displays also feature an extremely flat design, robust construction, and a long service life.
New passive infrared pyroelectric (PIR) motion sensor extends existing range; improves detection sensitivity over long distances