Farnell Announces Further Investment in Interconnect to Bring its Broadest range of Molex Products to Customers
Increased ‘in stock’ products across connectors, terminals, antennas and cable assemblies
Increased ‘in stock’ products across connectors, terminals, antennas and cable assemblies
Complementary Portfolio Simplifies Adoption of IEEE 1588 Synchronization in 5G Wireless, Transport and Access Networks
The ZESTRON Coating Layer Test, which is used to detect any coating defects on electronic…
The ultra-robust M9 technology platform will suit demanding automotive and high-end telematics.
Win a Microchip SAM R30M Xplained Pro from Electronica Azi International.
High quality, high reliability, AEC-Q101-qualified devices in DPAK
Murata has announced the PQU650 series of open-frame, 650 W-rated AC-DC power supplies by Murata…
The MAX17853 leverages the same board for multiple pack sizes, cutting design time by up to 50 percent for automotive applications
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0 mm