Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates
Following the market’s high demand for modules suiting highly integrated applications and rapid certification processes, Panasonic Industry now presents the PAN9028 Wi-Fi® radio module with integrated Bluetooth® wireless functionality.
A Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and an Ultracompact Package
PCOM-B645VGL features -40°C to 85°C wide operating temperature, real-time capability via 2.5 GbE port and BIOS configurable In-Band ECC (IBECC) memory
Kontron continues to update its 3U SBCs to introduce new capabilities
Represents a significant leap forward in the world of audio transport
Long-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for heterogeneous integration of different semiconductor process technologies.
Cloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and other Complex Applications
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…