Infineon expands Prime Switch family with ultra-reliable Press Pack IGBT for transmission and distribution applications and medium voltage drives
Infineon Technologies Bipolar GmbH & Co. KG expands the high-power Prime Switch family with the…
Infineon Technologies Bipolar GmbH & Co. KG expands the high-power Prime Switch family with the…
Driving the transition in product packaging by investing in capacity and portfolio
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate…
LEM, a leader in electrical measurement solutions, announced the launch of HMSR DA, the first…
Higher frequency AC/DC controllers and drivers improve industrial design while ensuring optimal efficiency across the load range
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV makers
Next-gen semiconductor drives 135W fast charger, Lenovo and Navitas shine on Nasdaq
AE Artesyn power shelf for latest 21” open rack systems delivers efficiencies above 97% and enables the transition to 48 V rack power in data centers
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.
Capacity bottlenecks can be closed more easily with the new KINO-TGL Thin Mini-ITX motherboard from…