Infineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications
The trends toward higher power density and cost optimization dominate the development goals of efficient…
The trends toward higher power density and cost optimization dominate the development goals of efficient…
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies,…
MicroCare, LLC, the industry’s leading manufacturer of critical cleaning, coating and lubricating products, recognized its…
We are pleased to announce that ICP Deutschland has taken over the businesses of IIE…
Sfera Labs has expanded its Strato Pi CM family of compact Raspberry Pi-based Compute Module…
Real-Time Systems (RTS) – a global provider of hypervisor technology and part of the congatec…
Anritsu Company introduces the Field Master™ MS2070A handheld spectrum analyzers that provide the performance and…
u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technology and services, has…
Toshiba Electronics Europe GmbH (“Toshiba”) has launched two intelligent power products to control the driving…
Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, and Hyperview, an autonomous driving tech…