Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated…
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated…
DFN0603 package improves performance while reducing space needs significantly
Nestwave NestCore™ GNSS IP solution drives down power consumption and component count in Renesas module based on Sequans Monarch 2 platform
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection…
The new Panel PC series PPC-JWS-J4125 from ICP Germany offers a good entry into the…
Downloadable ebook from Vicor shares insights into new power conversion trends and technologies to support vehicle electrification
BASELABS, the specialist for sensor fusion, adds dedicated functionality for automated parking to their algorithm…
New S32G3-based miriac System-on-Module offers 2.5 times more performance for functional safety applications
HighTec extends tool support for the new NXP S32 Automotive Platform processors to help enable automotive customers to build safe and secure applications
New Ryzen Embedded R-Series system-on-chips provide up to 2X more cores, enhanced Radeon graphics, Windows 11 support, and versatile, multi-display configurability