Bluetooth SiP Module from Silicon Labs Offers World’s Smallest Footprint for IoT End Nodes
6.5 mm x 6.5 mm BGM12x Module with Built-in Antenna Shrinks Board Area, Miniaturizes Bluetooth®-Enabled Designs without Sacrificing Performance
6.5 mm x 6.5 mm BGM12x Module with Built-in Antenna Shrinks Board Area, Miniaturizes Bluetooth®-Enabled Designs without Sacrificing Performance
Microchip announces the industry’s lowest-power Passive Entry/Passive Start (PEPS) solution: The ATA5700 and ATA5702 are…
SEGGER introduces Wi-Fi modules (2.4GHz and 5GHz supported) for its emPower Cortex-M Evaluation Platform. Getting…
NXP’s secure solution offers maximum design flexibility with broad connectivity options and NFC commissioning for quick deployment.
NXP, DAF Trucks, Siemens and Honda push the boundaries of secure V2X with live road demonstrations at electronica 2016
Murata announced the launch of a compact low cost low power wide area network (LPWAN)…
Aids implementation of high reliability industry automation designs
Thunderboard React Kit Accelerates IoT Design with Sensing, Processing and Bluetooth® Low Energy Connectivity
Wirepas and u-blox, a global leader in wireless and positioning modules and chips, have partnered…
Microchip announces the next generation of dual-mode Bluetooth® audio products. The IS206X family builds on…