Flexibility meets increased power density and performance: Infineon enhances 1200 V EconoDUAL™ 3 portfolio with IGBT7 featuring new current ratings
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™…
Application Board 3.0 provides a scalable, easy-to-use sensor development platform
The PH13CMI series from ICP Germany are motherboards in the classic Mini-ITX form factor design.…
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption
EE Raymond Yin and Dr. Jay Esfandyari Discuss Roles and Applications of Sensors in Industrial and IoT Environments
Global Distributor Leads in New Product Introductions
INTERCONTEC plug-and-play high-tech connectors are an ideal solution for connecting signal, data and/or power in specific applications, reducing downtime and increasing productivity.
ICP Deutschland offers with the MEC-LAN interface series an easy way to add LAN interfaces…
Kontron’s COMe-bTL6 (E2) Computer-on-Module offers up to 8 cores and supports four independent 4K displays or one 8K HDR display
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)