Allegro MicroSystems announces 4x4mm 50 V full-bridge gate drivers for automotive and industrial applications
New drivers enable fewer external components and smaller footprints while improving performance
New drivers enable fewer external components and smaller footprints while improving performance
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV makers
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.
Latest silicon carbide (SiC)-based VE-Trac modules provide next-generation electric vehicles with longer range, higher efficiency and faster acceleration
Compact driver board features reinforced isolation, ASIL B/C certification
Rugged and reliable devices are AEC-Q101 compliant and save board space
Ready-to-Start Development Platform Includes Renesas High-Performance Automotive RH850/U2x MCUs along with RTA-HVR Software from ETAS
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new CoolSiC™ technology: the CoolSiC™…
New Environment Allows Customers to Bring Leading-Edge Software to Market Quickly