Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC,…
Many industrial applications today are moving towards higher power levels with minimized power losses. One…
TTI IP&E – Europe will showcase new high-voltage connectors, sensors, relays, and power solutions to…
Anritsu Corporation has announced that German engineering services and test company, EDAG, recently purchased Anritsu’s…
Advanced Energy Industries, Inc. announced its Thyro-PX® Modular Solution, a fully configurable, distributed architecture that…
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride…
congatec – a leading provider of embedded and edge computing technology – premiered its heat…
Silicon Labs announced that its MG26 family of wireless SoCs is now generally available through…
Silicon Labs announced its new Series 2 BG29 family of wireless SoCs, designed to bring…
Anritsu Corporation is pleased to announce the extension of vector signal frequency up to 44…