Infineon’s CoolSiC™ MOSFETs 1200 V G2 in a Q-DPAK package enable higher power density for industrial applications
Infineon Technologies AG has launched the CoolSiC™ MOSFETs 1200 V G2 in a top-side-cooled (TSC)…
Infineon Technologies AG has launched the CoolSiC™ MOSFETs 1200 V G2 in a top-side-cooled (TSC)…
Rutronik is expanding its range of connectors with the PS series from Amphenol IPG Anytek.…
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced three new high-voltage…
XP Power revolutionises the configurable, modular power supply market with the introduction of its FLXPro…
Navitas Semiconductor, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide…
NGK Insulators, Ltd. and Torex Semiconductor Ltd have jointly developed a next-generation charging module equipped…
Rutronik is introducing the R-78K-0.5 series from RECOM, switching regulator modules that combine all the…
XP Power continues to make high power flexible for ease of integration across multiple platforms…
Time is running out to enter the 2025 Create the Future Design Contest, an exciting…
Toshiba Electronics Europe GmbH announces volume shipments of its 3rd generation, 650V silicon carbide (SiC)…