Kontron’s VX3060-S2 takes 3U OpenVPX™ to next level
Featuring 11th Gen Intel® SoC technology, developers can apply now for early access to Kontron’s industry-first Blade PC
Featuring 11th Gen Intel® SoC technology, developers can apply now for early access to Kontron’s industry-first Blade PC
Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC) which…
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future
PCOM-B645VGL features -40°C to 85°C wide operating temperature, real-time capability via 2.5 GbE port and BIOS configurable In-Band ECC (IBECC) memory
Kontron continues to update its 3U SBCs to introduce new capabilities
The PH13CMI series from ICP Germany are motherboards in the classic Mini-ITX form factor design.…
PICMG releases Platform Management Interface specification for COM-HPC
Microchip’s new low-density PolarFire®devices consume half the static power of alternatives while providing world’s smallest thermal footprint
Air Flow Click joins family of over 1000 peripheral development boards