congatec presents roadmap for SMARC 2.0, Qseven 2.1 and COM Express 3.0
congatec fully supports the upcoming new SGET and PICMG Computer-on-Module specifications
congatec fully supports the upcoming new SGET and PICMG Computer-on-Module specifications
Targets complex multi-tasking embedded system designs in automotive, broadcast, communications, industrial, medical, mil/aero, and test & measurement markets.
Renesas Electronics Europe and emtrion, a company that assists customers during all stages of the development…
EP&Dee is offering its readers the chance to win Microchip’s PIC32MZ Embedded Connectivity with FPU (EF) Starter Kit (DM320007).
Win the PICDEM™ Lab II Development Board (DM163046) from EP&Dee!
Microchip announces a flexible, low-cost, renewable monthly subscription license for the PRO editions of its…
congatec modules based on AMD Geode LX 800 processors now available at least until 2019.
Competition Sponsored by Intel and Other Industry Leaders Connects Research Community and Industry; Participants Deliver Passion and Quality in 5G Designs.
L2Tek, a manufacturers’ representative and distributor of components and sub-assemblies for professional video and high-speed…
For semi-industrial use, Fujitsu provides the new mainboards D3402-B and D3417-B of the Extended Lifecycle…