Renesas Launches 32-Bit RX671 MCUs Realizing High Performance and Power Efficiency with HMI Functions for Contactless Operation
A Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and an Ultracompact Package
A Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and an Ultracompact Package
PCOM-B645VGL features -40°C to 85°C wide operating temperature, real-time capability via 2.5 GbE port and BIOS configurable In-Band ECC (IBECC) memory
Kontron continues to update its 3U SBCs to introduce new capabilities
Represents a significant leap forward in the world of audio transport
Cloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and other Complex Applications
Application Board 3.0 provides a scalable, easy-to-use sensor development platform
The PH13CMI series from ICP Germany are motherboards in the classic Mini-ITX form factor design.…
In power electronics and the semiconductor market the system approach is gaining momentum. To support…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Panasonic Corporation have signed an agreement…
Agreement Facilitates Adoption of Robotics in Industrial and IoT Sectors; EK-RA6M5 Evaluation Kit Now Official Supported micro-ROS Development Board