PICMG Committee to Develop New Modular Box PC Open Specification
ModBlox7 introduces an open standard to proprietary multi-billion USD market
ModBlox7 introduces an open standard to proprietary multi-billion USD market
Three-part webinar series offers insights into the latest AI solutions for edge devices
First device in a series of six supports back-to-back connection of external N-channel MOSFETs
Reduced heat generation: The particularly low contact resistance of 5 mΩ enables significantly lower heat…
Dr. Rutger Wijburg will join the Management Board of Infineon Technologies AG (FSE: IFX /…
AVL provides Renesas Customers with Comprehensive Support for Development of Complex and Specialized Functional Safety Systems
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is strengthening its market leadership in power…
The new IGL130 and IGL160 fanless thin clients offer equivalent performance to mid and high-tier offerings from IGEL’s popular Universal Desktop line of hardware, shipping pre-imaged with IGEL OS for ease of deployment in remote locations.
Highly secure and robust LoRaWAN networking solution meets the needs of wide selection of IoT applications from retail to agricultural and from smart buildings to smart cites
DSM Engineering Materials today announces it has supported Samsung Electronics to deliver the first smartphone…