Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices
Driving the transition in product packaging by investing in capacity and portfolio
Driving the transition in product packaging by investing in capacity and portfolio
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate…
LEM, a leader in electrical measurement solutions, announced the launch of HMSR DA, the first…
Higher frequency AC/DC controllers and drivers improve industrial design while ensuring optimal efficiency across the load range
Global Authorised Distributor to Exhibit in Hall 4A Booth 102
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV makers
Next-gen semiconductor drives 135W fast charger, Lenovo and Navitas shine on Nasdaq
AE Artesyn power shelf for latest 21” open rack systems delivers efficiencies above 97% and enables the transition to 48 V rack power in data centers
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.
Capacity bottlenecks can be closed more easily with the new KINO-TGL Thin Mini-ITX motherboard from…