HIRO deploys next generation of scalable, edge micro data centres
Distributed edge infrastructure using modular power speeds processing and data transmission
Distributed edge infrastructure using modular power speeds processing and data transmission
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip
Point One and Quectel partnership creates highly affordable, small and easy to use high precision GNSS module integrating RTK for mass market applications
The new “RDK2” development kit from Rutronik is a complete solution for firmware and hardware…
Pre-provisioned modules enable out-of-the-box secure communication with AWS via Wi-Fi and cellular IoT
MAXM38643 and MAXM17225 feature the lowest quiescent current compared to competitive solutions; uSLIC built-in inductor technology reduces solution size by up to 37 percent
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company’s new AIROC™ IFW56810…
Performance boost for artificial intelligence in situational awareness, autonomous driving and predictive maintenance applications
Analog Devices, Inc. (ADI) introduced today the ADI EagleEye™ ADSW4000 PeopleCount algorithm for people detection…
Evaluation Kits and Tools for AC and DC Power Lines Let Developers to Immediately Evaluate Applications Supporting High-Speed Communication at Up to 1 Mbps