Improved power density: alpitronic selects Infineon’s EasyPACK™ CoolSiC™ modules and EiceDRIVER™ X3 drivers for its 50 kW hypercharger
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic…
To meet multiple requests from registered exhibitors and enable all participants to plan with the…
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announced…
The new THERM-A-GAPTM PAD 30 and 60 from Parker Chomerics further optimise heat transfer applications in electronic systems
High bandwidth, high availability routers with optional SD-WAN
CUI Devices’ Thermal Management Group today announced the recent expansion of its dc fans and…
Providing advanced energy harvesting solutions for maintenance-free operation of IoT devices
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new…
Distributed edge infrastructure using modular power speeds processing and data transmission
Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip