Bluetooth SiP Module from Silicon Labs Offers World’s Smallest Footprint for IoT End Nodes
6.5 mm x 6.5 mm BGM12x Module with Built-in Antenna Shrinks Board Area, Miniaturizes Bluetooth®-Enabled Designs without Sacrificing Performance
6.5 mm x 6.5 mm BGM12x Module with Built-in Antenna Shrinks Board Area, Miniaturizes Bluetooth®-Enabled Designs without Sacrificing Performance
Microchip announces a new generation of 8-bit tinyAVR MCUs. The four new devices range from…
Murata has released three series of 6W high isolation DC-DC converters from Murata Power Solutions…
Microchip announces the industry’s lowest-power Passive Entry/Passive Start (PEPS) solution: The ATA5700 and ATA5702 are…
Superior IC technology heightens performance plus expanded interfacing enables connection with Arduino & mikroBUS™ related hardware
New arrival on the embedded systems market Bridgetek has just introduced a series of development…
Industry-leading current-shunt monitor improves efficiency and accuracy for motor and solenoid control applications
Highly integrated ISL78226 addresses 48V hybrid powertrains that provide improved emissions and better fuel economy
Continuing to drive innovation in USB technology, FTDI Chip has now introduced a series of…
Next-generation LED platform rolled out by the open ISELED Alliance (Inova Semiconductors, Dominant Opto Technologies, NXP, TE Connectivity, and Pforzheim University)