Melexis announces world’s first dual die latch and switch sensor
Advanced packaging delivers flexible accurate measurement and redundant operation
Advanced packaging delivers flexible accurate measurement and redundant operation
Prototyped Low-Power Embedded SRAM that Realizes Battery-Free Operation and Extended Battery Lifetimes for IoT, Home Electronics, and Healthcare Applications
Murata has added a new feature to its website’s sensor guide, making it even quicker…
The VIA DCM family are ruggedized modular DC-DC converters in a thermally adept, low profile…
New chipset simplifies design of robust and future-proof solutions for automotive, industrial and smart cities.
In combining two high-performance low RDSON nFETs and fast over-voltage protection, Silego expands the state-of-the-art system protection to USB Type C applications.
Rockchip RV1108 visual processor with CEVA-XM4 DSP handles Evomotion’s high-resolution real-time stitching on-board at 70% lower power consumption compared to CPU/GPU implementations.
Renesas Electronics Europe, a premier supplier of advanced semiconductor solutions, today announced that it has…
Murata announced the results of its collaboration with both STMicro (http://www.st.com/content/st_com/en.html) and SigFox (https://www.sigfox.com/en) to…
XP Power has announced the UCP225 series of high power density, very low profile 225W…