Kontron meets new challenges in Embedded Computing with NXP Layerscape® Arm-based Processors
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), today announced a range of…
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), today announced a range of…
X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs
Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.
Toshiba Memory Europe GmbH has today started sampling Universal Flash Storage (UFS) devices[1] utilising Toshiba Memory…
Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the availability of the…
Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components,…
Boosters allow scalable drive up to 60 A peak gate current; full protection features included
Ultra-low power connectivity and battery-free sensing solutions enable development of novel IoT use cases
Designed for -40°C to +125°C Operation, Device Features Low and Flat Resistance of 0.37 Ω and High 338 MHz Bandwidth in Compact miniQFN16 Package
Ideal for portable devices, tablets, and optical devices!