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  • Electronica azi International

    Accelerate high-precision contactless magnetic sensing design with UNI Hall 3 Click board from MIKROE

    Nordic Semiconductor proves Bluetooth High Data Throughput feature in silicon

    Microchip Brings EtherCAT® and TSN Networking Solutions to its Power-Efficient PolarFire® FPGA Platform

    Expertise and solutions for e-mobility

    donpedro5 March 201902.7K views

    HARTING Technology Group offers cost- and time-saving charging technology and is a partner of major car manufacturers

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    Maxim’s Heart-Rate Sensor Designed Into Fujitsu Connected Technologies’ New Raku Raku Smartphone F-01L for Seniors

    donpedro5 March 201902.6K views

    MAX30101 enables users to measure stress levels and arterial aging

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    Texas Instruments Partners with Digi-Key to Sponsor TechMatch Start-Up Competition

    donpedro5 March 201902.6K views

    Twelve start-ups entered the race for prizes totaling over €30,000 ($34,000) at the TechMatch start-up…

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    C&K launches the first vandal-resistant sealed switches for use in hostile environments and remote locations

    donpedro4 March 201902.1K views

    New tamper-proof pushbutton switches are perfect for outdoor applications such as alarm, safety and security systems and car park ticket machines

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    Wurth Electronics To Make Big Appearance at APEC 2019

    donpedro4 March 201902.4K views

    Wurth Electronics is excited to announce their return to the APEC exhibition as a Gold…

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    Jack-of-all trades server ready to take over industrial controls

    donpedro1 March 201902.5K views

    Intel, congatec and Real-Time Systems present industrial-grade application server platform for multiple real-time controls

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    Performance boost for rugged edge computing markets

    donpedro1 March 201902.5K views

    congatec COM Express Type 7 module with AMD EPYC Embedded 3000 processor

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    congatec premieres with 40% performance boost

    donpedro1 March 201902.6K views

    congatec enters the 3.5 inch single board computer (SBC) business

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    Consumer BGA processors on high-quality embedded boards

    donpedro1 March 201902.5K views

    congatec presents 8th Gen Intel Core Mobile processors on embedded form factors

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    Indium Corporation Launches InFORMS® ESM02 for Die-Level Bonding

    donpedro28 February 201902.3K views

    Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce…

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