Silex Insight, a leading provider for flexible security IP cores, announce a collaboration with Xilinx, Inc. to provide a hardware security module (HSM) for the Xilinx Zynq UltraScale+ MPSoC family, which is available as of today.
The Hessian flux specialist further expands its portfolio of flux pastes for special applications and will present the new flux paste EO-FP-002 for repair work at the productronica 2019 in Munich.
The ultra-robust M9 technology platform will suit demanding automotive and high-end telematics.
Win a Microchip SAM R30M Xplained Pro from Electronica Azi International.
High quality, high reliability, AEC-Q101-qualified devices in DPAK
Murata has announced the PQU650 series of open-frame, 650 W-rated AC-DC power supplies by Murata…
The MAX17853 leverages the same board for multiple pack sizes, cutting design time by up to 50 percent for automotive applications
FDE854LBF suits longer distance or restricted power applications; generates less heat in sensitive, enclosed designs
The concept of the smart factory is on everyone’s lips. Companies that turn this forward-thinking…
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0 mm