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  • Electronica azi International

    Mission accomplished: Infineon technology proves reliable once again in space on Artemis II

    Microchip Expands dsPIC33A DSC Family for High-Density AI Data Center Power, Complex Motor Control and Intelligent Sensing

    Moxa Achieves First IEC 62443-4-2 Certification for Serial Device Server Under IECEE Scheme

    Insight SiP launches new ISP1907-LL RF module

    donpedro10 September 201902.3K views

    With its built-in antenna, it offers Bluetooth 5.1 standard communication for Long Range and Direction-Finding connectivity.

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    IBC 2019: Belden Introduces MPO Solution that Delivers High-Speed Signals for Today’s Ever Increasing Bandwidth Requirements in the Entertainment Industry

    donpedro9 September 201902.2K views

    A singlemode fiber cable solution that is reliable, rugged and easy-to-connect

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    Excelfore collaborates with Microsoft on Automotive OTA

    donpedro9 September 201902.5K views

    Excelfore, an innovator in automotive over-the-air (OTA) and data aggregation technologies, announces that its eSync…

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    AiOT accelerator card for inference at the Edge

    donpedro9 September 201902.3K views

    With the Mustang-V100 series, ICP Deutschland offers a flexibly scalable solution for implementing Deep Learning…

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    Harwin Bestows Avnet Abacus with its Sales Excellence Award for Second Year in Succession

    donpedro9 September 201902.4K views

    As a sign of appreciation for the exceptional work done by its staff over the…

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    Trends, ideas and know-how for consistently clean parts

    donpedro6 September 201902.5K views

    parts2clean 2019 (22–24 October)

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    eSync platform drives most extensive in-vehicle OTA deployment seen worldwide

    donpedro6 September 201902.5K views

    The eSync Alliance reports that member company Excelfore has announced the deployment of the eSync…

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    FAW deploys the Excelfore eSync platform for automotive over-the-air (OTA) updates

    donpedro6 September 201902.5K views

    Excelfore, a pioneer of automotive data management, announces that FAW, one of China’s largest automotive…

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    Molex Releases the Micro-Latch 2.00mm Wire-to-Board Connector System

    donpedro5 September 201902.3K views

    This new system is designed for use with harsh environments needing high-current ratings in constrained spaces.

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    Nexperia secures $1,500M financing to fund future growth plans

    donpedro5 September 201902.4K views

    Leading discrete semiconductor company’s refinancing fully supported

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