The MAX17853 leverages the same board for multiple pack sizes, cutting design time by up to 50 percent for automotive applications
FDE854LBF suits longer distance or restricted power applications; generates less heat in sensitive, enclosed designs
The concept of the smart factory is on everyone’s lips. Companies that turn this forward-thinking…
For Under the Hood Applications, AEC-Q200 Qualified Devices Feature Operating Temperatures as High as +155 °C and Profiles as Low as 1.0 mm
New supplier range of high-quality test products to support electronic design and maintenance.
With 55 Partner Companies at Launch, the Robust Ecosystem Enables Quick and Easy Solution Selection
Whether for artificial intelligence, augmented reality or the Internet of Things – 5 billion people…
CUI Devices’ Interconnect Group (https://www.cuidevices.com/catalog/interconnect) today announced the addition of screwless terminal block connectors (https://www.cuidevices.com/catalog/interconnect/connectors/terminal-blocks)…
Infineon Technologies AG will add a new member to its automotive microcontroller family AURIX™. TC3A will…
INGUN Prüfmittelbau GmbH, the leading manufacturer of spring-loaded test probes and test fixtures, strengthens its…