TDK develops low-resistance multilayer ferrite inductors for NFC
TDK Corporation (TSE: 6762) has developed the new MLJ-H1005 inductors for use in NFC* (near…
TDK Corporation (TSE: 6762) has developed the new MLJ-H1005 inductors for use in NFC* (near…
February 16, 2021 — CUI Devices’ Sensors Group today announced the addition of ultrasonic sensors to its…
New high-side current sense amplifier offers the industry’s lowest offset for AEC-Q100 Grade 0 qualified devices, enabling a more accurate and energy efficient current measurement solution for those applications exposed to extreme temperatures
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new IMD110 SmartDriver series. The…
Specifications 7″ Panel PC with PoE functionality PoE according to IEEE802.3at/af Capacitive touch with anti-glare…
Further progressing its goal of making battery-less technology more commonplace, e-peas has gained another big…
Robustly designed RF connectors for reliability and high performance
Due to the Corona pandemic, many companies are rethinking their supply routes. Particularly when the…
AEC-Q200 Qualified Device Withstands High Temperatures Up to +185 °C, Offers a Thermal Gradient of < 0.01 K/K and 6 s Response Time in Air
SEGGER announces its Embedded Studio build for the newly released Apple M1, Apple’s first ARM-based…