Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.
Capacity bottlenecks can be closed more easily with the new KINO-TGL Thin Mini-ITX motherboard from…
The RAC20E-K/277 adds a 20 W AC/DC converter with high power density to RECOM’s E-K…
iSYSTEM’s winIDEA Analyzer now supports the AUTOSAR Run-Time Interface (ARTI) and the ASAM ARTI MDF4 trace format
MAYA-W2 is among the first host-based modules to extend the benefits of highly efficient Wi-Fi 6 to industrial applications.
In addition to the solar fluxes EO-S-002 with 2 % solids and a very low…
Next-gen semiconductor unlocks fastest possible charging for the new motorola edge+, powering over 50% in 15 minutes*
Latest silicon carbide (SiC)-based VE-Trac modules provide next-generation electric vehicles with longer range, higher efficiency and faster acceleration
Compact driver board features reinforced isolation, ASIL B/C certification