Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the AIROC™ CYW20829 Bluetooth® LE system on chip (SoC). The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the […]
READ MOREInfineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC™ Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s AIROC CYW30739 Bluetooth LE & 802.15.4 system on chip (SoC) is a reliable, secure and scalable solution to connect low-power devices in the smart […]
READ MOREMouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the BGM220P and BGM220S Bluetooth® modules from Silicon Labs. Based on the Silicon Labs EFR32BG22 Wireless Gecko system-on-chips (SoCs), the BGM220 modules are a pre-certified, Bluetooth 5.2 solution for wireless networking in applications such as portable medical, connected home, wellness devices, asset tags, and beacons. […]
READ MOREIts unique feature set make the u-blox NINA-B4 series of stand-alone modules ideal for indoor positioning applications and for deployments in harsh environments.
READ MORE