Soldering pastes & materials

In addition to the solar fluxes EO-S-002 with 2 % solids and a very low resin content and the completely resin-free EO-S-007 with also 2 % solids content, which are in great demand on the market, Emil Otto is systematically expanding its portfolio for solar fluxes. In doing so, the flux specialist is pursuing a […]

Solutions can be applied by automated methods to reduce assembly costs and time to market

Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S. As an industry leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions. Indium Corporation’s indium-containing TIMs for burn-in and test offer […]

Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany. InTACK™ is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ […]

Hall 4 Booth 429

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature […]

Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, Calif., U.S. Indium Corporation is a leader in high-performance liquid metal-based thermal interface materials (TIM) with advanced knowledge and experience in high-volume TIM0, TIM1, and TIM2 applications. Indium Corporation’s Gallitherm™ portfolio of gallium-based liquid […]

Collaboration enables high volume, cost-effective, organic and printed sensors

Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany. Indium Corporation is the leader in power electronics assembly materials as a variety of industries—including automotive, transportation, computing, and energy infrastructure—demand more from power electronics systems. Indium […]

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications. WS-3910 is a water-soluble, halogen-free flip-chip flux that is designed for low-temperature—150°C—bismuth-tin applications. WS-3910 is chemically designed to exhibit minimal evaporation after application. Its composition also eliminates compatibility underfills by having a completely water-cleanable […]