Soldering pastes & materials

Indium Corporation’s newest jetting solder paste, PicoShot® NC-5M, has received official approval from Mycronic as a qualified jetting solder paste. PicoShot® NC-5M and its associated purging gel are designed for customers needing a halogen-free no-clean SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules. Developed jointly with Mycronic, PicoShot® NC-5M is […]

Indium Corporation will feature its innovative high-reliability, low-temperature alloy system during the virtual IPC APEX Expo, to be held March 8-12. Durafuse™ LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop […]

Indium Corporation’s Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at the virtual IPC APEX Expo, to be held March 8-12. For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high-reliability and high thermal conductivity, metals have been a great […]

Indium Corporation’s Kim Flanagan, Technical Support Engineer, will host an InSIDER Series webinar on reflow fundamentals in two sessions on Wednesday, Feb. 10 at 9 a.m. Eastern Time (2 p.m. British Time) and Tuesday, Feb. 16 at 9 a.m. Eastern Time (2 p.m. British Time). Soldering defects in SMT can arise from three main areas: […]

Indium Corporation announces that it is now offering CW-232, a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance. Indium Corporation’s CW-232 is a highly activated rosin flux-cored wire developed to meet the demanding requirements of robotic and laser soldering applications by delivering additional wetting power in order to […]

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance […]

MacDermid Alpha Electronics Solutions, a global leader in soldering and electronics assembly technologies, is pleased to launch ALPHA® OM-372, an ultra-fine feature, lead-free, no-clean solder paste designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. Developed to respond to the demands of increased miniaturization, ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine […]

Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1. The SD1 Automated Intelligent Micro-dispenser dispenses at a minimum of 80µm, the smallest solder dot in the world, with gaps as small as 20µm, while downsizing the equipment footprint up to […]

It is no secret that building an efficient small and medium sized electronics production is not an easy process. This is not only because of the need to select the right engineers, R&D departments and production models, but especially because of the need to make the right decisions about tools and equipment. When making these […]

7 things to remember in order to get properly dressed for work. Many companies in the electronics industry are struggling with problems resulting from damage to sensitive components due to ESD. Of course, there can be many reasons for this, but practice shows that they are often the result of using the wrong workwear – […]