Soldering pastes & materials

Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program. Live@Productronica benefits all participants, including Indium Corporation, its industry partners, and, most importantly, customers, through live product demonstrations on the show floor. These events provide attendees […]

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany. Indium Corporation is redefining solder with its InFORMS® solder preforms and patent-pending solder ribbon. InFORMS® are a composite solder material with a reinforcing matrix. This results in: Improved mechanical and thermal reliability Uniform bondline thickness Low-voiding performance InFORMS® do more than […]

In today’s world of electronics, semiconductor components are essential. For the manufacturing of these components the cleaning of metal surfaces before wire bonding or injection molding of the semiconductor housing is still an important and necessary step. Contaminated and oxidized metal surfaces can cause low wire bond strength and lead to failures due to interruption […]

Indium Corporation will feature its new high-performance, high-reliability low-temperature alloy technology at Productronica, November 12-15, Munich, Germany. DurafuseTM LT is a novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, DurafuseTM […]

Indium Corporation will continue to celebrate its 85th anniversary by featuring some of its industry-leading and newest alloys at Productronica, November 12-15, in Munich, Germany. Since its founding, Indium Corporation has continued to research and develop new solutions for common industry issues of the day, while anticipating the industry’s future needs and challenges. Originating with […]

Indium Corporation has released TACFlux® 108HF, a new no-clean, halogen-free, high tack force flux for hand soldering and rework applications. TACFlux® 108HF is compatible with SAC Pb-free alloys for PCB assembly applications. It joins Indium Corporation’s versatile offering of specialty fluxes designed to provide solutions for current and evolving industry challenges. Benefits include: Halogen-free per […]

Michael Kövi, Senior Process Engineer, ZESTRON Europe, will be presenting, “Cleanliness Before Conformal Coating” at “Advanced Electronics Assembly Conference”. Mr. Kövi’s presentations will be on: 19th November, 2019 at Novotel Budapest Centrum, Budapest, Hungary and on 21st November, 2019: DoubleTree by Hilton Oradea, Oradea, Romania The reliability requirements of electronic assemblies used for high-tech applications, […]

Emil Otto has developed the Flux Cover PFS-001 for the surface protection of component connections. The product will be presented to the professional public for the first time at the productronica 2019. “Our new flux cover is an aqueous, milky liquid that is used for the coating of the surfaces of component connections and provides […]

Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore 2019, December 4-6, in Singapore. WS-446HF is a water-soluble, halogen-free flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad […]

Due to increasing miniaturization and packing density on assemblies Plasmatreat GmbH has recorded a higher demand for Openair-Plasma in combination with conformal coatings in electronic manufacturing. Plasma application as pre-treatment to conformal coating of assemblies and components ensures that the process window for conformal coating is widened, guaranteeing long-lasting connections and functionality. “If we look […]