SMT Technology

The requirements for electronic assemblies are becoming more and more demanding. This is not only due to an increase in packaging density and progressive miniaturization, but also to an increase in areas of application. For example, reliable bonding and sealing processes are becoming more important in electronics manufacturing, due to electric vehicles and the associated […]

CITE 8 is equipped with the latest intelligence – More power in less time

Having access to comprehensive, flexible and most-of-all speedy services is critically important for operators of highly automated electronics production lines. Technology leader ASM stands out in this field by breaking new ground on the road to Service 4.0 with its broad portfolio of layered service solutions. By combining connectivity with new technologies and services, ASM […]

Farnell’s Extensive High-Quality Range includes more than 2,000 high-quality Electrostatic Discharge (ESD) products from Multicomp Pro, SCS, DESCO, SIMCO-ION and Raaco

Indium Corporation will feature its reclaim and recycle services for indium-containing materials at SVC TechCon 2020, April 18-23, in Chicago, Ill., USA. Indium Corporation is a longtime provider of reclaim services and has the largest capacity worldwide. The company provides analytic reports, high-yield return, and competitive pricing. It offers reclaim services for: Indium-tin oxide (ITO), […]

250th thermode produced

Just like during a thunderstorm, electrostatic discharges can also occur in industrial environments. Whenever the differences between the charges of two objects are big enough this will result in a sudden equalization of electric potential. This flashover can destroy electronic components. Electromagnetic fields created by changes in electric currents and voltages can damage components as […]

IPTE, one of the world’s leading suppliers of automated production equipment for the electronics and mechanics industry, again participates at the common booth “Future Packaging” at SMTconnect in Nuremberg (May 5 – 7). The common booth “Future Packaging” is located in hall 5, booth 434. The line at SMTconnect 2020 gives an opportunity to get […]

Tepex continuous-fiber-reinforced thermoplastic composite materials from Bond-Laminates demonstrate excellent fire resistance even without flame-retardant additives due to the special structure of the semi-finished products. This is the result of comprehensive investigations and tests that the LANXESS subsidiary – partly in cooperation with external testing institutes – has carried out with a view to typical Tepex […]

Indium Corporation will feature its high-performance liquid metal thermal interface materials (TIMs) at the 36th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI-THERM), March 16-20, in San Jose, Calif., USA.  Indium Corporation offers a number of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, […]