Aiming high: KEMET‘s KONNEKT™ technology is a high-density package technology that enables components to be interconnected without the use of metal frames, thus reducing ESR, ESL and thermal resistance of capacitors. This uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution. The capacitors are available at https://www.rutronik24.com. The […]

GTX series offers superior attenuation performance with a compact, lightweight, and high-density design

C44U-M, C44P-R, and R75H series offer reliable power conversion and power density performance