Hides automatically in 15 seconds. Hide now
  • HOME
  • MICROCONTROLLERS
    • 8-bit
    • 16-bit
    • 32-bit
    • DSPs & DSCs
  • EMBEDDED SYSTEMS
    • Embedded Computing
    • Industry 4.0
    • Artificial intelligence
    • Automotive
    • FPGAs
    • MPUs
    • SoC / SoM / SBC
    • Development boards
    • MEMS Sensors
    • Cobots
  • INDUSTRIAL CONTROL
    • Sensors
    • AFE
    • Cables/Connecting
    • Actuators
    • HMI
    • Test & Equipment
    • Software
    • Electromechanical & networking switches
  • IoT
    • Cybersecurity
    • IoT applications
    • Wireless
    • RF
  • LIGHTING
    • Lighting applications
    • Displays/Opto
    • LEDs
    • X-Ray
  • POWER
    • Power applications
    • Power supplies
    • Power modules
    • PLCs
    • Transformers
  • Electronics Components
    • Passive
    • Active
    • Storage
  • SMT TECHNOLOGY
    • Soldering pastes & materials
    • PCB Design
    • Equipment
Home Power Power applications Ericsson Power Modules

Ericsson’s advanced bus converter module raises the bar for high power control and delivery

7 JULY 2016

Ericsson Power Modules announces the BMR458, a third-generation 3E* quarter-brick advanced bus converter that delivers industry-leading performance to system architects developing equipment for Information and Communication Technology (ICT) applications, including datacom and server and storage systems. The module is ideal for high-power applications that are powered by multi-cell batteries or rectifiers commonly used in the […]

READ MORE
  • PLCs
  • Power modules
  • Power supplies
  • Transformers

Producers

  • Microchip Technology
  • Freescale
  • Renesas
  • Infineon
  • Maxim Integrated
  • NXP
  • Texas Instruments
  • Murata
  • Power Integrations
  • LEM
  • Dialog Semiconductor
  • Lattice Semiconductor
  • Silicon Labs
  • Semtech
  • IDT
  • Intersil
  • Powerbox
  • FTDI Chip
  • Toshiba
  • Microsemi
  • Vicor Corporation
  • Exar
  • Diodes Inc.
  • Melexis
  • STMicroelectronics
  • ON Semiconductor
  • Vishay Intertechnology
  • Ericsson Power Modules
  • CUI
  • Würth Elektronik
  • ROHM Semiconductor
  • Nexperia
  • TT Electronics
  • ICP Deutschland
  • Flex
  • Allegro MicroSystems
  • CUI Devices
  • VAC (VACUUMSCHMELZE)
  • e-peas
  • KEMET

Search news and articles

5G AI ARM automotive BLE technology Bluetooth Bluetooth LE Bluetooth v5.0 COM Express controllers GPS Industry 4.0 IoT Kinetis MCUs MEMS sensor MOST PoE RFID USB USB C
Close

Magazine Archives

  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2017
  • 2018
  • 2019
  • 2020
    • Contact
    • Advertising
    • Newsletter
    • Privacy Policy (GDPR) & Cookies
    ©2021 EURO STANDARD PRESS 2000
    This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish.Accept Read More
    Privacy & Cookies Policy