SoC
PCIe 3.1 Ethernet bridges using low-power sub-states enable power savings for embedded and automotive platforms
12 FEBRUARY 2019Microchip announces the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express® (PCIe®) 3.1 Low-Power Sub-State (LPSS) L1.1 and L1.2 for power savings. The LAN7430 provides integrated power, clocks and an Ethernet physical (PHY) interface while the LAN7431 provides Reduced Gigabit Media-Independent Interface (RGMII) […]
READ MOREMicrochip’s First Libero SoC Design Suite Release Boosts FPGA Designer Productivity and Delivers One Unified Design Suite for Latest Families
29 JANUARY 2019New version delivers significant productivity gains while marking major production milestones for the low-power PolarFire™ FPGA family
READ MOREIndustry’s first RISC-V SoC FPGA architecture brings real-time to Linux, giving developers the freedom to innovate in low-power, secure and reliable designs
4 DECEMBER 2018Microchip, via its Microsemi Corporation subsidiary, announces an extension to its Mi-V ecosystem by unveiling the architecture for a new class of SoC FPGAs at the RISC-V Summit, Dec. 4 to 5, 2018. The new family combines the industry’s lowest power mid-range PolarFire™ FPGA family with a complete microprocessor subsystem based on the open, royalty-free […]
READ MORERenesas Electronics Delivers High-End 3D Graphics for Large-Scale Display Instrument Clusters with R-Car E3 System-On-Chip
17 OCTOBER 2018Single-Chip SoC Reduces System Costs and Expands Scalability Across the R-Car Family for Integrated Instrument Clusters and IVI Systems Such as Display Audio
READ MORERenesas Electronics Introduces Integrated Open Image Signal Processor Solution for Automotive Camera System Development with MM Solutions
18 SEPTEMBER 2018Featuring MM Solutions’ AutoCDK Tool, Open ISP Solution Expands Flexibility and Ease of Use for Front and Surround View Cameras Using R-Car System-on-Chips
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