Infineon Technologies AG worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices. The reference design uses the REAL3™ 3D Time-of-Flight (ToF) sensor and enables a standardized, cost-effective and […]

Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated with software and 3D Time of Flight system specialist pmdtechnologies ag to develop the world’s smallest and at the same […]

City dwellers often spend a large amount of their time indoors, either in an office, at school, or simply at home. Urbanized spaces, however, tend to trap and develop bad air quality as they get more insulated for energy efficiency purposes. The concentration of CO2 is an indicator for bad air quality. Today´s market solutions for […]

Infineon Technologies AG is presenting its latest sensors and solutions for intelligent mobility, the smart home, connected industry, robotics, and health and fitness at this year’s Sensor+Test. The exhibits and solutions are on view during the trade fair (25 to 27 June) at stand 429 in hall 1. One main topic of the semiconductor manufacturer […]

Infineon Technologies AG launches the XENSIV TM DPS368. The miniaturized digital barometric pressure sensor is capable of measuring both pressure and temperature. It offers an ultra-high precision of ±2 cm and a low current consumption for precise measurement of altitude, air flow and body movements. This makes the DPS368 ideal for mobile applications and wearable devices offering […]

Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies AG developed the REAL3™ IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market. The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as “Product of the Year” in the category “Sensors”. The Award […]

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the TLE5501 XENSIV™ magnetic sensors from Infineon Technologies. Infineon’s first magnetic sensors based on tunnel magneto resistance (TMR) technology, the TLE5501 sensors are ideal for automotive brushless DC (BLDC) motor commutation in devices such as wipers, pumps, and […]

Includes all Elements to Simplify and Expedite Biometric Smart Card Technology

Semiconductors are key components for the Internet of Things (IoT). They connect the real with the digital world now evolving to cloud services and artificial intelligence (AI) functionality. Infineon Technologies AG allows for easy and secured use of new generation sensors featuring new AI functionalities running on Amazon Web Services (AWS). Infineon’s XMC4000™ family of […]

The dual die 360° angle sensor TLE5012BD from Infineon is designed for angular position sensing in automotive applications such as electrical commutated motors, steering angle measurements or general angular sensing. It detects the orientation of a magnetic field by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance (iGMR) elements. The TLE5012BD […]