Embedded Systems

Premier Farnell launches Texas Instruments reference designs to ease the development of power solutions for Xilinx MPSoC, SoC and FPGA applications

9 MAY 2018

Scalable power supply design simplifies and speeds development of power solutions for the Xilinx Zynq UltraScale+ MPSoC family

New university robotics kit and curriculum from TI prepare future engineers for systems-level design

15 FEBRUARY 2018

To stay competitive in a world increasing in complexity and efficiency, today’s engineering students must graduate with an understanding of engineering concepts across multiple disciplines and products. To equip future engineers with this strong foundation in systems-level design, Texas Instruments (TI) has announced its newest educational solution for the university classroom, the TI Robotics System Learning Kit (TI-RSLK).

TI revolutionizes automotive headlight systems with new high-resolution DLP® technology

9 JANUARY 2018

Sophisticated new adaptive driving beam headlight technology enables automakers and Tier-1 suppliers to enhance driver visibility and communication

Merge the worlds of wired and wireless connectivity by connecting sensors to the cloud with new TI SimpleLink™ Ethernet MCUs

28 NOVEMBER 2017

Simplify industrial gateway designs using new Ethernet MCUs with an integrated PHY leveraging 100 percent code compatibility across the SimpleLink MCU platform

TI DLP® technology enables next-generation augmented reality head-up displays

17 NOVEMBER 2017

New automotive-qualified DLP3030-Q1 chipset and EVMs allow automakers and Tier-1 suppliers to create HUD systems with crisp, high-quality imagery

TI enables the widest bandwidth and lowest phase noise for next-generation high-speed systems

28 JUNE 2017

First 6.4-GSPS, 12-bit ADC and wideband 15-GHz PLL with VCO drives higher performance while reducing system size.