Striving to make life easier for engineers, FTDI Chip has just launched an online community. Bringing an additional dimension to the company’s existing array of technical support capabilities, this new engineering resource is designed to encourage ongoing interaction between its members – providing a knowledge base that facilitates the sharing of ideas and project information. […]
READ MORETo complement its FT602 USB 3.1 (Gen 1) video class FIFO IC, which has now gone into full scale production, FTDI Chip has introduced a pair of accompanying hardware modules. The UMFT602A and UMFT602X units enable bridging of a FIFO bus to a USB3.0/1 host and are equipped with either HSMC or FMC (LPC) connectors. […]
READ MOREIn order to better serve the broadening range of mar-kets it has developed products for, FTDI Chip has established a new dis-tinct company – called Bridgetek. Presenting the embedded engineering sector with a well-defined and targeted operation, Bridgetek will drive the further commercialisation of some of the game-changing technologies introduced by FTDI Chip in recent […]
READ MOREFTDI Chip has introduced a series of easy-to-utilize modules to facilitate the evaluation, development and subsequent implementation of its 32-bit FT90X Super-Bridge MCUs. This will mean that engineers in the embedded space are better positioned to benefit from the industry-leading performance levels and extensive connectivity that these highly advanced ICs are able to deliver. Optimized […]
READ MORETo encourage the widespread utilisation of its highly cost-effective and easy-to-implement next generation USB interfacing technology, FTDI Chip has unveiled a new family of evaluation/development modules. The company’s FT600/1Q USB 3.0 SuperSpeed ICs, which are already in full volume production, are forthwith backed up by the UMFT60XX offering. This module family is made of 4 […]
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