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Home Electronics Components Active Infineon

Infineon takes lead in MEMS microphone market, launches new technologies for further improved acoustical performance and power consumption

7 JANUARY 2021

According to research consultancy Omdia* 1, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully positioned itself as the market leader for MEMS microphones. Based on MEMS chip unit sales, the market share was reported to have been catapulted to a staggering 43.5 percent. This positions Infineon at #1 with a lead of almost 4 […]

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Tailored to perform in resonant topologies: the new 650 V CoolMOS™ CFD7

1 OCTOBER 2020

For SMPS designs in industrial applications recent technology trends include the need for high efficiency and power density as well as increased bus voltages. This triggers the need for power devices with 650 V breakdown voltage. With its 650 V CoolMOS™ CFD7 product family Infineon Technologies AG meets these demands. The devices are best suited for resonant […]

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Infineon adds D²PAK real 2-pin packages to its CoolSiC™ Schottky diode family

26 MARCH 2020

Infineon Technologies AG expands its CoolSiC™ Schottky diode 1200 V portfolio by adding six devices in a D²PAK real 2-pin package. Using SMD packages, designs can be more compact and more cost effective. Moreover, the new D²PAK real 2-pin package eliminates the middle pin to offer 4.7 mm creepage and 4.4 mm clearance distance. Compared […]

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Infineon withdraws outlook for FY20; economic impact resulting from coronavirus pandemic can currently not be reliably assessed

26 MARCH 2020

The more and more pronounced coronavirus pandemic worldwide is causing severe disruptions to global supply chains, endmarkets and economies. Developments around the coronavirus are very dynamic and result in low visibility. In view of this, Infineon Technologies AG is withdrawing its outlook for the 2020 fiscal year. Originally the company had anticipated to grow revenues […]

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Infineon to become a carbon-neutral company

20 FEBRUARY 2020

Infineon Technologies AG will become carbon-neutral by 2030. The company presented its plans at its Annual General Meeting in Munich. Infineon is thus making an active contribution to reducing CO 2 worldwide and achieving the targets defined in the Paris Climate Agreement. The objective relates to its own greenhouse gas footprint and includes not only all direct […]

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iMOTION™ IMC300 adds Arm® MCU for maximum flexibility

18 FEBRUARY 2020

Infineon Technologies AG is releasing the new IMC300 motor controller series. It combines the iMOTION™ Motion Control Engine (MCE) with an additional microcontroller based on the Arm® Cortex®-M0 core. IMC300 complements the IMC100 series and aims at variable speed drives that require very high application flexibility. Both families, IMC100 and IMC300, share the same implementation […]

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Infineon scales up volume production and accelerates roll-out of CoolSiC™ MOSFET broad portfolio in discrete housings

7 MAY 2019

Infineon Technologies AG enters high volume production of a comprehensive portfolio of 1200 V CoolSiC™ MOSFET devices. They are rated from 30 mΩ to 350 mΩ and implemented into TO247-3 and TO247-4 housings. The expansion includes a surface mount device (SMD) portfolio and a 650 V CoolSiC MOSFET product family, both to be launched soon. […]

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Higher efficiency for EV DC charging and other industrial applications: New CoolSiC™ Schottky diode 1200 V G5 portfolio from Infineon

7 MAY 2019

Infineon Technologies AG is extending the CoolSiC™ Schottky 1200 V G5 diode portfolio with the release of a TO247-2 package. It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC […]

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Infineon XENSIV™ TLI4971: New current sensor for industrial applications

3 MAY 2019

Infineon Technologies AG will launch a new family of current sensors and is presenting its first member at this year’s PCIM trade fair. The family will consist of precise and stable coreless Hall sensors. They offer a high level of flexibility as customers can individually program product parameters such as the current range, the overcurrent […]

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Protecting communication within the smart factory and to the cloud: Infineon presents the world’s first TPM 2.0 for Industry 4.0

27 MARCH 2019

Infineon Technologies AG presents the world’s first Trusted Platform Module (TPM) specifically for industrial applications at this year’s Hannover Messe (Hannover, Germany, 1-5 April 2019). The OPTIGA™ TPM SLM 9670 protects the integrity and identity of industrial PCs, servers, industrial controllers or edge gateways. It controls access to sensitive data in key positions in a […]

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