Indium Corporation Introduces Liquid Flip-Chip Flux

1 MARCH 2022

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.

WS-3910 is a water-soluble, halogen-free flip-chip flux that is designed for low-temperature—150°C—bismuth-tin applications. WS-3910 is chemically designed to exhibit minimal evaporation after application. Its composition also eliminates compatibility underfills by having a completely water-cleanable residue.

WS-3910:

  • Features low evaporation after application, offering a more flexible process window than other similar fluxes; it does not dry out during reflow
  • Shows strong activity at low temperatures, with a current peak reflow temperature of 150°C, making it ideal for applications where oxide formation is unwanted
  • Compatible with spraying applications

Indium Corporation

Leave a Reply

Your email address will not be published. Required fields are marked *

  • We use your personal data ONLY to respond to your comments/requests.
  • To receive responses that are appropriate to your requests, we may transfer your email address and your name to the author of the article.
  • For more information on our Privacy Policy and Personal Data Processing, please visit the page: Privacy Policy (GDPR) & Cookies.
  • If you have any questions or concerns regarding the way we process your personal data, you can contact our Data Protection Officer at: gdpr@esp2000.ro
  • Subscribe to our magazine newsletter