Ultra-thin SO6L package offers easy upgrade path to reduce height in existing and new designs
Toshiba Electronics Europe GmbH (“Toshiba”) has introduced two photocouplers (TLP5705H and TLP5702H), housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs. The rugged devices are ideally suited to applications in industrial equipment including inverters, AC servo drives, photovoltaic (PV) inverters and uninterruptible power supplies (UPS)
The TLP5705H is Toshiba’s first product to deliver a peak output current rating of ±5.0A in a thin SO6L package while the TLP5702H has a peak output current rating of ±2.5A. When designing with these new photocouplers, systems such as small to medium capacity inverters and AC servo drives that use buffer circuits for current amplification can now drive their IGBTs/MOSFETs directly from the photocoupler. This eliminates the need for any buffer circuit while simplifying design, reducing part count and enabling miniaturisation.
The SO6L package occupies a footprint of just 10.0mm x 3.84mm and can be mounted on the PCB land pattern of a conventional SDIP6 package, facilitating an easy upgrade path for Toshiba’s current photocouplers, such as the TLP700H.
At only 2.3mm (max.) high, the SO6L package is thinner than the current 4.25mm tall SDIP6, which brings greater flexibility to component placement, and also allows it to be mounted on the reverse side of a PCB or used where physical constraints impose limits on available height. Where a larger lead-form is required, the TLP5702H(LF4) and TLP5705H(LF4) designate parts with identical electrical performance, housed in an SO6L(LF4) package with wider pin distance.
All of the new photocouplers operate from a supply voltage (VCC) between 15 to 30V DC and offer a propagation delay of just 200ns. They all operate at temperatures between -40°C and +125°C making them ideal for industrial applications and other harsh environments.
Volume shipments of the new devices start today.