ALPHA OM-220 was developed in response to the ever-increasing complexity of electronic assemblies and incorporation of heat-sensitive components. Featuring the ULT1 alloy, this innovative solder chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. The lower reflow temperatures enable use of lower cost substrates and components and reduced warpage on both components and substrates compared to traditional SAC processes. Additionally, ALPHA OM-220 has demonstrated excellent electrical reliability, having passed JIS Z 3197 & J-STD-004B SIR testing, and exhibits low voiding characteristics, having passed IPC Class 3 voiding on BGA components.
Another characteristic of ALPHA OM-220 is that it permits cascaded or hierarchical soldering, as well as novel hermetic sealing solutions. “This solder paste is designed to respond to the growing needs for low-temperature processing and we are pleased to bring to market a solution that provides our customers efficiencies in both energy use and materials cost,” said Rahul Raut, Director of Strategy and Acquisition at MacDermid Alpha. “This technology is well suited for a broad range of applications involving temperature-sensitive assemblies, such as consumer electronics, in-cabin automotive electronics and medical devices.”
ALPHA OM-220 is safe and environmentally friendly to use. It is both halide-free and zero-halogen compliant and meets the latest RoHS and REACH standards for compliance.