Latest CPU technology on 170 × 170 mm

11 FEBRUARY 2021

Capacity bottlenecks can be closed more easily with the new tKINO-ULT6 Thin Mini-ITX motherboard from ICP Germany. In addition to the latest CPU technology, the tKINO-ULT6 also offers many improved interfaces that provide a significant performance boost. The tKINO-ULT6 supports the Intel® CoreTM processors of the 11th generation. This generation is known under the former name Tiger Lake. In addition to the Intel® CoreTM i7-1185G7E, CoreTM i5-1145G7E and CoreTM i3-1115G4E with configurable thermal design power, a cost-effective Celeron® 6305E is also available. All variants support up to 64GB of RAM with a clock frequency of 3200 MHz on the two horizontally arranged DDR4 SO-DIMM slots. The onboard Intel® HD graphics unit supports four independent displays with a maximum resolution of 4K on the available display port, HDMI, USB Type-C as well as eDP/LVDS interfaces. Furthermore, the tKINO-ULT6 offers a performance increase on the two LAN ports. Two Intel® i255V network controllers offer a transmission speed of up to 2.5GbE. The basic configuration includes one USB4.0, four USB3.2 of generation 2, four USB2.0, one serial interface each implemented as RS-232/422/485 with AFC as well as one RS-422/485 with AFC support, four serial RS-232 interfaces, PS/2 as well as four digital inputs and four digital outputs. The tKINO-ULT6 offers expansion options via the PCI Express x8 slot with Generation PEX4 signal, the M.2 2230 A-Key with PEX1 and USB signal, the M.2 2242/2280 M-Key with PEX2 and SATA signal as well as the TPM connector. The tKINO-ULT6 is designed for a voltage range of 9 to 36 volts DC and can be operated in a temperature range of -20 °C to 60 °C. Upon customer request, ICP also delivers the tKINO-ULT6 as a bundle with suitable industrial RAM and storage media.

tKINO-ULT6 – Thin Mini-ITX Board for 11th Generation CoreTM Processors

Specifications

  • Thin Mini-ITX motherboard
  • Intel® Tigerlake-UP3 11th Gen. CoreTM i7/i5/i3 mobile CPU
  • Max. 64GB DDR4 SO-DIMM memory
  • Quadruple Display Support
  • Dual Intel® 2.5GbE LAN
  • M.2 2280, M.2 2230, PCIe x4 Gen.4
  • USB4, USB3.2, RS-232, RS485

Applications

  • Panel PC and Embedded Systems
  • Compact PC Systems
  • Industrial PC Systems
  • Image and video processing

ICP Deutschland

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