Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at Productronica

7 NOVEMBER 2019

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at Productronica, November 12-15, Munich, Germany.

Indium Corporation is redefining solder with its InFORMS® solder preforms and patent-pending solder ribbon. InFORMS® are a composite solder material with a reinforcing matrix. This results in:

  • Improved mechanical and thermal reliability
  • Uniform bondline thickness
  • Low-voiding performance

InFORMS® do more than just bond two surfaces—they are designed to address specific challenges of the power electronics industry. InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.

For more information about InFORMS®, visit www.indium.com/informs or visit the Indium Corporation at Productronica, Hall A4, Booth 214.

Indium Corporation

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