Premium SIPLACE TX platform features major improvements

13 JULY 2018

Faster, more accurate, more flexible

Equipped with the new SpeedStar head, the SIPLACE TX’s placement performance has been increased by 23 percent to up to 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 × 8.2 mm.

SIPLACE TX placement modules are known for setting industry records in performance, accuracy and space efficiency. Now technology leader ASM is pushing the envelope to the limit by presenting a new version of its premium platform that features major improvements. Equipped with the new SpeedStar head, the new model’s placement performance has been increased by another 23 percent to up to 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 x 8.2 mm. Other advantages of the new model include reduced power consumption and the planned long-board option for boards with lengths of up to 510 mm.

The new CP20P2 placement head is at the core of the improved SIPLACE TX. Thanks to further technological improvements, ASM’s developers were able to increase the placement performance of the new head by more than 23 percent from 39,000 to 48,000 cph. They also installed a component camera with improved resolution and larger vision field, better component sensors, and a more robust contactless data and power transmission system.

Equipped with two of the new SIPLACE SpeedStar placement heads, the SIPLACE TX can place up to 96,000 components per hour in sizes ranging from 0201 (metric) to 8.2 × 8.2 × 4 mm. Despite the significant speed increase, the new SIPLACE TX still operates with exceptional accuracy rated at 25 µm @ 3 sigma – just like the preceding version. The placement force can now be reduced to as little as 0.5 N in order to place sensitive components even more gently than before. And the new placement head suspension allows significantly easier and faster head changeovers – for example, to the highly flexible SIPLACE MultiStar.

More flexible
To take full advantage of the new model’s performance, components are supplied via the new SIPLACE SmartFeeder Xi feeders with faster and more accurate transport systems or the new SIPLACE BulkFeeders X, whose cartridges can hold up to 1.5 million components in bulk. In addition, special options like the SIPLACE Smart Pin Support and the Long Board Option for boards with lengths of up to 510 mm will be available for the new version of the SIPLACE TX.

All of this is good news for electronics manufacturers who already operate SIPLACE TX modules on their lines. Since current and new models are based on identical components (with two exceptions), spare parts logistics will be mostly unchanged. ASM will switch its global SIPLACE TX shipments to the improved modules in the winter of 2018. The SIPLACE TX is aimed at demanding high-volume manufacturers in Europe, North America, South America, and Asia.

The SMT Solutions segment of ASM Pacific Technology
Since the acquisition of printing specialist DEK and its integration into ASM Pacific Technology (ASMPT) on July 2, 2014, ASM Assembly Systems has been operating as ASMPT’s SMT Solutions segment consisting of the Printing Solutions Division (DEK) and the Placement Solutions Division (SIPLACE).
SMT Solutions develops and sells best-in-class DEK printers for the SMT, semiconductor and solar markets as well as best-in-class SIPLACE SMT placement solutions. Both divisions use the ASMPT organization to let their customers enjoy significant competitive benefits. The SMT Solutions segment of ASMPT shares and expands its expertise with electronics manufacturers and partners all over the world. Its goal is to improve its customers’ workflows and use new technologies to advance process integration in the industry.

For more information about SIPLACE and DEK, visit

ASM Pacific Technology |

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