Rutronik at embedded world: Hall 1, stands 1-310 and 249

19 JANUARY 2014

Complete component portfolio offers maximum depth of integration for embedded systems.

Rutronik Elektronische Bauelemente GmbH is presenting its portfolio of embedded computing boards, displays, memory components, auto ID, wireless modules and intelligent sensors with maximum depth of integration for the embedded systems of the future (stands 1-310 und 1-249). For this reason, Rutronik is today responding to the requirements for the future project Industrie 4.0 and the integrated approach for all networked applications.
At its trade fairs stands, Rutronik is exhibiting the technological foundation for the Internet of Things and Services in all functional and practical details. These include a comprehensive portfolio of RISC-based board solutions with module solutions as well as single-board computers from various manufacturers. Highlights of the x86 segment are the industrial AMD embedded G-series ‘eKabini’, Intel’s new Atom platform ‘Bay Trail’ and the 4th generation Intel Core i technology. In the storage area, Rutronik is exhibiting the new EM-MLC (Endurance Managed – Multi Level Cell) SD, microSD and SSD Flash memory cards, some with Lifetime monitoring tools, as well as MLC SSDs for the expanded temperature range. Rutronik is introducing TFT displays with integrated projected-capacitive and resistive touchscreen technology as well as without touchscreens in sizes up to 19″ from its new franchise partner DLC Display. Experienced product and application engineers will be available to provide fair visitors with expert advice.

Rutronik
www.rutronik.com

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