MARTIN demonstrated Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

17 MAY 2012

MARTIN presented its Mini-Oven Reball/Solder Bumping unit at the last SMTA Toronto Expo & Tech Forum, at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.
The MINIOVEN 04 provides a reflow environment in a compact, standalone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and will accommodate up to 99 profiles, with the ability to edit individual profiles and fine tune parameters. A gas connection is available for processing gases, such as nitrogen, argon and formic.


Leave a Reply

Your email address will not be published. Required fields are marked *

  • We use your personal data ONLY to respond to your comments/requests.
  • To receive responses that are appropriate to your requests, we may transfer your email address and your name to the author of the article.
  • For more information on our Privacy Policy and Personal Data Processing, please visit the page: Privacy Policy (GDPR) & Cookies.
  • If you have any questions or concerns regarding the way we process your personal data, you can contact our Data Protection Officer at:
  • Subscribe to our magazine newsletter