MARTIN presented its Mini-Oven Reball/Solder Bumping unit at the last SMTA Toronto Expo & Tech Forum, at the Crowne Plaza Toronto Airport Hotel in Ontario, Canada.
The MINIOVEN 04 provides a reflow environment in a compact, standalone unit and is ideal for pre-bumping QFNs and reballing BGAs and CSPs. The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process. The unit offers programmable modes and will accommodate up to 99 profiles, with the ability to edit individual profiles and fine tune parameters. A gas connection is available for processing gases, such as nitrogen, argon and formic.