Seika Machinery to Debut Multi-Point Selective Soldering System at the IPC APEX Expo

19 MARCH 2012

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will introduce the Andes Solbot II Multi-Point Selective Soldering System in Booth #2401 at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California.
The Solbot Selective Soldering System uses customized and dedicated fixtures/nozzles. The lead-free compatible system is user-friendly and features a compact footprint of only 540×720×250 mm. The Solbot can solder PCBs up to 260×340 mm. Additionally, the number of components on the PCB does not affect tact time.

Seika Machinery, Inc.
www.seikausa.com

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