Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011


Nordson DAGE, a division of Nordson Corporation will highlight its latest bond testing and X-ray inspection capabilities at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), scheduled to take place November 15-16, 2011 at the McEnery Convention Center in San Jose, CA. The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting. Also featured at the show will be the Nordson DAGE μCT Inspection Option, which provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems.

Nordson DAGE

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