MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo


MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum on November 2, 2011 at the Grand Long Beach Event Center in Long Beach, CA. The Mini-Oven 04 provides controlled air circulation, ensuring that hot air continually flows around the component and thus heats it equally from all sides. The unit offers programmable modes and a nitrogen process gas supply for minimizing solder oxidation. Up to 99 profiles can be stored, with the ability to edit individual profiles and fine tune parameters.
The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.
The unit also is ideal for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow.


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